FoodSkin

We present FoodSkin, a technique for adding interactive elements to foods by implementing edible circuits on the surface of the food. The circuit is easily fabricated using commercially available materials. Existing approaches to enhance the eating experience, such as presenting an electrical taste by making food part of an electronic circuit, are challenging to apply to foods with low water content due to their low conductivity. Our technique enables the integration of dry foods into an electronic circuit and provides displaying (e.g., smell or taste) and sensing (e.g., eating activity) functionalities. We describe our fabrication technique with a library of food materials that we can utilize, evaluate the conductivity and adhesion of the gold-leaf traces, introduce demonstrative applications, and conclude with a workshop we conducted to evaluate the accessibility of our technique. FoodSkin enriches the design space for the computer- augmented eating experience by enabling the digital fabrication of electronics on versatile materials, surfaces, and shapes of foods.

Kunihiro Kato*, Kaori Ikematsu*, Hiromi Nakamura, Hinako Suzaki, and Yuki Igarashi. FoodSkin: Fabricating Edible Gold Leaf Circuits on Food Surfaces. In Proceedings of the 2024 CHI Conference on Human Factors in Computing Systems (CHI'24), To appear, (2024). (*joint first authors) [DOI]
須﨑比奈子, 加藤邦拓, 池松香, 中村裕美, 五十嵐悠紀. 可食回路のセンシングを利用した子ども向けの食行動改善アプリケーションの提案. 情報処理学会第86回全国大会論文集, To appear, (2024). [Link]
須﨑比奈子, 中村裕美, 池松香, 加藤邦拓, 五十嵐悠紀. 金箔加工が及ぼす食品自体の味や食感への影響調査. 情報処理学会研究報告ヒューマンコンピュータインタラクション(HCI), Vol.2023-HCI-205(26), pp.1–5, (2023). [Link]
Kunihiro Kato, Ami Motomura, Kaori Ikematsu, Hiromi Nakamura, and Yuki Igarashi. Demonstrating FoodSkin: A Method for Creating Electronic Circuits on Food Surfaces by Using Edible Gold Leaf for Enhancement of Eating Experience. In the CHI Conference on Human Factors in Computing Systems CHI 2023 Extended Abstracts Proceedings (CHI'23 EA), Article No.434, pp.1–4, (2023). [DOI] [Video]
元村愛美, 中村裕美, 池松香, 五十嵐悠紀, 加藤邦拓. FoodSkin: 金箔回路を用いて電気味覚を実現する食品拡張手法の提案. 情報処理学会研究報告ヒューマンコンピュータインタラクション(HCI), Vol.2022-HCI-200(21), pp.1–6, (2022). [Link]
元村愛美, 中村裕美, 池松香, 五十嵐悠紀, 加藤邦拓. 金箔回路を用いた食品の機能的拡張. 第30回インタラクティブシステムとソフトウェアに関するワークショップ (WISS 2022)論文集, 1-C07, (2022). [Link]

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